행사

  • to

    Location: Seoul, Korea

    Venue: Coex

  • to

    Location: Chengdu, China

    Venue: Chengdu Century City New International Convention & Exhibition Center

  • to

    Location: New Delhi, India

    Venue: Pragati Maidan, booth 2185

  • to

    Location: Shanghai New International Expo Centre (SNIEC)

    Venue: Hall E4 Booth 4600

  • to

    Location: Santa Clara, CA USA

    Venue: Santa Clara Convention Center

    Artesyn Embedded Technologies' Chief Architect Hyperscale and Cloud Solutions, Doug Sandy, will be speaking on Power Considerations for Open Rack during the OCP US Summit 2017.

    Thursday, March 9 • 10:00am - 10:25am
    Panel: Power Considerations for Open Rack
  • to

    Location: Washington, D.C.

    Venue: Georgetown University & Conference Center

    Artesyn and Wind River will be co-presenting a workshop, followed by a 30-minute panel session.  Artesyn will also be showcasing the ControlSafe Platform and the ControlSafe Expansion Box Platform, SIL4 Certified Fail-Safe and Fault-Tolerant COTS platforms for train signalling and railway control. 

  • to

    Location: Las Vegas, Nevada, USA

    Venue: Las Vegas Convention Center

    Artesyn Embedded Technologies will be showcasing it's latest streaming video transcoding products at the NAB Show. 

  • to

    Location: RAI Amsterdam

    Venue: RAI Amsterdam

    IBC is the premier annual event for professionals engaged in the creation, management and delivery of entertainment and news content worldwide. 

  • to

    Location: Barcelona, Spain

    Venue: Fira Gran Via

    Mobile World Congress is the world’s largest gathering for the mobile industry. Artesyn will present the service innovations driving change in network edge applications.

아티슨 임베디드 테크놀로지스